Gap Pad HC5.0
Futures & Benefits：
● Thermal Conductivity：5.0 W/m-K
● Thickness：0.508mm～3.175mm
● Continuous Use Temp.：-60℃ ～200℃
● Dielectric Breakdown Voltage (Vac.)：5000V
● High-compliance, low compression stress
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● Thermal Conductivity：5.0 W/m-K
● Thickness：0.508mm～3.175mm
● Continuous Use Temp.：-60℃ ～200℃
● Dielectric Breakdown Voltage (Vac.)：5000V
● High-compliance, low compression stress
Product details
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