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Sil Pad - High dielectric strength
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Poly-Pad K-4
Poly-Pad K-4
Futures & Benefits
● Thermal Conductivity:0.9 W/m-K
● Thickness:0.152mm
● Continuous Use Temp.:-20℃ ~150℃
● Dielectric Breakdown Voltage (Vac.):6000V
● Excellent dielectric and physical strength
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Product details